HARRISBURG, Pa., Jan. 31, 2018 /PRNewswire/ — TE Connectivity (TE), a world leader in connectivity and sensors, and Credo, a leading provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high performance computing markets, today announced they have teamed up to demonstrate the future of networking technologies. The companies will hold demonstrations of 112Gbps over a chip to module (IO) channel and over a backplane channel at DesignCon 2018. The demonstrations will be unveiled in booth #817 at DesignCon, which takes place in the Santa Clara, CA convention center from January 31 through February 1. As industry groups such as OIF and IEEE meet to discuss feasibility of these types of links at these next-generation data rates, TE and Credo will be demonstrating performance on actual hardware.
The IO channel demonstration uses TE’s OSFP IO connector with Credo’s 16nm, lower power, high performance 112G PAM4 SerDes technology to exhibit operation over a 10-inch printed circuit board (PCB) channel. The “O” is for “octal” — it is being designed to use eight electrical lanes to deliver 400GbE — and “SFP” is for “small form factor pluggable.” The channel is driven by Credo’s 112G PAM4 SerDes, which is operating over a total ball-to-ball channel loss of >15 decibel (dB). The demo shows bit error rate (BER) performance of better than 1e-7. The OSFP IO connector is a state-of-the-art 8 channel IO connector currently adopted for 400Gbps applications. The demonstration establishes TE’s OSFP connector performance as an 800Gbps-capable IO solution.
The backplane demonstration uses TE’s latest STRADA Whisper orthogonal backplane connector operating with a total channel loss of 20 dB at 28 GHz in a PCB-based direct plug orthogonal (DPO) architecture. Driven by Credo’s 112G PAM4 SerDes, the demo shows BER performance levels that fully enable the adoption of STRADA Whisper solutions for the next wave of networking equipment.
“Credo’s proven low power silicon expertise being advanced to 112G SerDes is a key technology milestone. Credo is enabling the industry to progress quickly to 112Gbps serial electrical signaling, which may pave the way for accelerating the deployment of 112G single lane, end-to-end network connectivity. Enabling faster data, in smaller spaces at a potentially lower cost,” said TE’s Nathan Tracy, technologist, member of system architecture team and industry standards manager.
“TE’s OSFP IO connector demonstrates the extremely low noise performance that will be required in 112Gbps IO applications. In addition, the performance of TE’s latest STRADA Whisper backplane connector enables the balance of the 112Gbps signaling interconnect ecosystem. TE’s world-class interconnect performance has demonstrated that it is 112Gbps ready,” said Jeff Twombly, vice president of business development at Credo.
To learn more about TE’s live demonstrations at DesignCon or schedule an on-site meeting, visit our DesignCon 2018 events page.
ABOUT TE CONNECTIVITY
TE Connectivity Ltd. (NYSE: TEL) is a $13 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 78,000 employees, including more than 7,000 engineers, working alongside customers in nearly 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.
TE, TE Connectivity, TE connectivity (logo), STRADA Whisper and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies.
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About Credo Semiconductor
Credo is a leading provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high performance computing markets. Credo’s advanced Serializer-Deserializer (SerDes) technology delivers the bandwidth scalability and end-to-end signal integrity for next generation platforms requiring single-lane 25G, 50G, and 100G connectivity. The company makes its SerDes available in the form of Intellectual Property (IP) licensing on the most advanced processing nodes and with complementary product families focused on extending reach and multiplexing to higher data rates: www.credosemi.com
TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies.
Other logos, product(s) and/or company names might be trademarks of their respective owners.
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SOURCE TE Connectivity
